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Influence of underetching of plasmonic antennas on their optical response
Novák, Martin ; Nebojsa, Alois (referee) ; Šamořil, Tomáš (advisor)
Influence optical response on underetching of plasmonic antennas is observed in this thesis. When light falls with resonant wavelength on the optical antennas, the electromagnetic field is amplified near this antennas. The resonant wavelength depends on the length of the antenna and on effective refractive index given by the ambient properties around the antenna. The contact surface with substrate (dielectric) is reduced by underetching the antenna and the effective refractive index is changed and thus the optical response of the antenna is changed.
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Application onf the Focused Ion on Electron Beam in Nanotechnologies
Šamořil, Tomáš ; Mikulík, Petr (referee) ; Jiruše, Jaroslav (referee) ; Šikola, Tomáš (advisor)
Nowadays, the systems that allow simultaneous employment of both focused electron and ion beams are very important tools in the field of micro- and nanotechnology. In addition to imaging and analysis, they can be used for lithography, which is applied for preparation of structures with required shapes and dimensions at the micrometer and nanometer scale. The first part of the thesis deals with one lithographic method – focused electron or ion beam induced deposition, for which a suitable adjustment of exposition parameters is searched and quality of deposited metal structures in terms of shape and elemental composition studied. Subsequently, attention is paid also to other types of lithographic methods (electron or ion beam lithography), which are applied in preparation of etching masks for the subsequent selective wet etching of silicon single crystals. In addition to optimization of mentioned techniques, the application of etched silicon surfaces for, e.g., selective growth of metal structures has been studied. The last part of the thesis is focused on functional properties of selected 2D or 3D structures.
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Fabrication of micro- and nanostructures by different etching methods
Těšík, Jan ; Urbánek, Michal (referee) ; Šamořil, Tomáš (advisor)
The selective etching is currently very widely used method for the preparation of micro- and nanostructures. This thesis deals with the principles of the etching methods, their applications and also the possibilities of dry and wet etching at the Institute of Physical Engineering. The experimental part is devoted to the preparation of the etching masks to ensure etching selectivity and to the preparation of pre-defined micro- and nanostructures. Important parameters were determined from the results, e.g. Si etch rate, selectivity of the masks etc. Further, the suitability of the used methods and etching masks were compared.
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SMV-2019-04: Large-area nanostructures preparing
Horáček, Miroslav ; Kolařík, Vladimír ; Matějka, Milan ; Krátký, Stanislav ; Chlumská, Jana ; Meluzín, Petr ; Král, Stanislav
The development of sandwich nanostructures on doped silicon substrate. The dimension of nanostructures and their pitch is very close to the capability of used e-beam system Raith EBPG5000+. Thin silicon nitride layer was prepared on doped silicon substrate. This layer is needed for wet etching of silicon. The golden markers needed for direct writing of multiple patterns were prepared by the way of e-beam lithography and vacuum evaporation. Mask in the resist layer was exposed for etching of the silicon nitride mask by reactive ion etching in the next step. Wet etching of silicon was carried out after the mask was prepared. Small pyramids were created by the etching process. The last lithography step was preparation of the mask over the pyramids. Thin aluminum layer in the areas where the pyramids are presented was prepared by the way of vacuum evaporation and lift-off technique.
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SMV-2019-03: Thin membranes
Krátký, Stanislav ; Matějka, Milan ; Chlumská, Jana ; Horáček, Miroslav ; Kolařík, Vladimír ; Meluzín, Petr ; Král, Stanislav
The development of technology for preparation of very thin silicon nitride membrane for use in low energy electron spectroscopy. Several techniques for preparation of thin membranes were tested during the development – wet etching, reactive ion etching, plasma etching, low-frequency plasma etching. Comparative method for the measurement of such thin membranes was developer also.
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Influence of underetching of plasmonic antennas on their optical response
Novák, Martin ; Nebojsa, Alois (referee) ; Šamořil, Tomáš (advisor)
Influence optical response on underetching of plasmonic antennas is observed in this thesis. When light falls with resonant wavelength on the optical antennas, the electromagnetic field is amplified near this antennas. The resonant wavelength depends on the length of the antenna and on effective refractive index given by the ambient properties around the antenna. The contact surface with substrate (dielectric) is reduced by underetching the antenna and the effective refractive index is changed and thus the optical response of the antenna is changed.
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Application onf the Focused Ion on Electron Beam in Nanotechnologies
Šamořil, Tomáš ; Mikulík, Petr (referee) ; Jiruše, Jaroslav (referee) ; Šikola, Tomáš (advisor)
Nowadays, the systems that allow simultaneous employment of both focused electron and ion beams are very important tools in the field of micro- and nanotechnology. In addition to imaging and analysis, they can be used for lithography, which is applied for preparation of structures with required shapes and dimensions at the micrometer and nanometer scale. The first part of the thesis deals with one lithographic method – focused electron or ion beam induced deposition, for which a suitable adjustment of exposition parameters is searched and quality of deposited metal structures in terms of shape and elemental composition studied. Subsequently, attention is paid also to other types of lithographic methods (electron or ion beam lithography), which are applied in preparation of etching masks for the subsequent selective wet etching of silicon single crystals. In addition to optimization of mentioned techniques, the application of etched silicon surfaces for, e.g., selective growth of metal structures has been studied. The last part of the thesis is focused on functional properties of selected 2D or 3D structures.
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|
|
Fabrication of micro- and nanostructures by different etching methods
Těšík, Jan ; Urbánek, Michal (referee) ; Šamořil, Tomáš (advisor)
The selective etching is currently very widely used method for the preparation of micro- and nanostructures. This thesis deals with the principles of the etching methods, their applications and also the possibilities of dry and wet etching at the Institute of Physical Engineering. The experimental part is devoted to the preparation of the etching masks to ensure etching selectivity and to the preparation of pre-defined micro- and nanostructures. Important parameters were determined from the results, e.g. Si etch rate, selectivity of the masks etc. Further, the suitability of the used methods and etching masks were compared.
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